Temperature prediction in three-dimensional (3D) parts
US12145319B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jan 23, 2019 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Jul 14, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.