Method for reducing heat transfer into an enclosure of a cooler
US12145791B2 · kind B2 · utility
0Cited by
60References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2023 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Apr 2, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B31/04
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A cooler capable of achieving a sufficient temperature gradient between an inside of the cooler and an outside of the cooler such that at least a partial vacuum forms within the cooler may include an enclosure defined by at least one wall and a lid. The lid may form a relatively airtight seal with a wall of the cooler when in a closed position. A vacuum release assembly may be disposed in one of the walls or lid of the cooler, the assembly being capable of reducing a pressure differential between the enclosure and the outside of the cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.