Plate package, plate and heat exchanger device
US12146713B2 · kind B2 · utility
0Cited by
16References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Sep 17, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2250/102
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A plate package for a heat exchanger device includes a plurality of heat exchanger plates with mating abutment portions forming a fluid distribution element in every second plate interspace thereby forming in the respective second plate interspaces two arc-shaped flow paths. A respective one of the two flow paths is divided into at least three flow path sectors arranged one after the other along a respective flow path. A plate and a heat exchanger are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.