Patent · US Active

Co-packaging photonic integrated circuits and application specific integrated circuits

US12147073B1 · kind B1 · utility

0Cited by

0References

11Claims

0Family size

Assignee

ACACIA COMMUNICATIONS, INC. · US

Inventors

Christopher Doerr · Fryeburg, US
Eric Swanson · Gloucester, US
Diedrik Vermeulen · New York, US
Saeid Azemati · Waltham, US
Jon Stahl · Maynard, US

Key dates

Filing date	Feb 26, 2020
Grant date	Nov 19, 2024
Priority date	—
Expiry date	Sep 6, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16225
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.