Offset alignment method and micro-lithographic printing device
US12147168B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 12, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Sep 7, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7019
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An offset alignment method for a micro-lithographic printing device comprises placing (S10) of an alignment target substrate. A target pattern presents areas of at least two different light reflectivities is defined relative an origin point. The alignment target substrate is illuminated (S20). Reflected light is measured (S30). A reflection image of the target pattern is created (S40) by the measured light. The illumination is made according to a test pattern of light, having areas with and without illumination. The test pattern is defined relative an origin point. A measured target pattern origin point is determined (S50) from target pattern associated features in the reflection image and a measured test pattern origin point is determined from test patterns associated features in the reflection image. An offset between a measured position and a written position is calculated (S60) from the measured target pattern origin point and the measured test pattern origin point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.