Thermal diffuser for a semiconductor wafer holder
US12148650B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Nov 9, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Nov 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating assembly includes a support member for supporting a target thereon, a diffuser layer attached to the support member, and a heater attached to the diffuser layer. The diffuser layer includes discrete diffuser segments separated by gaps. The discrete diffuser segments are made of the same material and are configured to allow a desired thermal gradient to be maintained between the discrete diffuser segments during heating of the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.