Sidewall connections and button interconnects for molded SiPs
US12148741B2 · kind B2 · utility
0Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Mar 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.