Active bridge enabled co-packaged photonic transceiver

US12148742B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Thomas Liljeberg · Calabasas, US
• Andrew C. Alduino · Santa Clara, US
• Ravindranath V. Mahajan · Chandler, US
• Ling Liao · Santa Clara, US
• Kenneth M. Brown · Carson City, US
• James E. Jaussi · Hillsboro, US
• Bharadwaj Parthasarathy · Plano, US
• Nitin A. Deshpande · Chandler, US

Key dates

• Filing date: Mar 12, 2020
• Grant date: Nov 19, 2024
• Expiry date: Mar 12, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/17051
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.