Wireless headset, assembly method, electronic device and storage medium
US12149876B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2420/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a wireless headset, an assembly method, an electronic device and a storage medium. The wireless headset includes a housing, a mainboard and a pressure sensitive component. The housing includes: a first chamber defined in a head portion of the wireless headset, and a second chamber defined in a rod portion of the wireless headset and in communication with the first chamber. The mainboard includes: a first circuit board disposed in the first chamber, a second circuit board disposed in the second chamber and provided with a relief portion, and an adapter circuit board disposed in the housing and configured to connect the first circuit board with the second circuit board. The pressure sensitive component is disposed in the second chamber and between the relief portion and the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.