Bend compensation for conductive traces on printed circuit boards
US12150240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2023 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Apr 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/024
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.