Package assembly
US12150243B2 · kind B2 · utility
0Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Jul 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.