Electromagnetic compatibility contact between metal castings and printed circuit boards
US12150251B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2023 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Apr 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.