Electronic device including clad components
US12150264B1 · kind B1 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2024 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Apr 30, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0086
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.