Cooling apparatus for power module
US12150273B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
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Key dates
| Filing date | Nov 4, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | May 23, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.