Patent · US Active

Device and method for beam shaping and beam modulation during laser material processing

US12151306B2 · kind B2 · utility

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0References
12Claims
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Key dates

Filing dateNov 25, 2019
Grant dateNov 26, 2024
Priority date
Expiry dateJan 10, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B27/0983
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A device and a method for beam shaping and beam movement during laser material processing with a laser beam source (1) for continuously emitting a laser beam (2), a first optical deflection element (3), a second optical deflection element (4), and an optical focusing element (5) arranged between the second optical deflection element (4) and a workpiece surface (7) to be processed. The second optical deflection element (4) is configured to displace a point of incidence of the laser beam (2) on the workpiece surface (7), and the first optical deflection element (3) is configured to alter a position of a focal plane of the laser beam (2) relative to the workpiece surface (7) by means of a translational movement and/or to change an intensity distribution within a beam cross section of the laser beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.