Device and method for beam shaping and beam modulation during laser material processing
US12151306B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2019 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jan 10, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/0983
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device and a method for beam shaping and beam movement during laser material processing with a laser beam source (1) for continuously emitting a laser beam (2), a first optical deflection element (3), a second optical deflection element (4), and an optical focusing element (5) arranged between the second optical deflection element (4) and a workpiece surface (7) to be processed. The second optical deflection element (4) is configured to displace a point of incidence of the laser beam (2) on the workpiece surface (7), and the first optical deflection element (3) is configured to alter a position of a focal plane of the laser beam (2) relative to the workpiece surface (7) by means of a translational movement and/or to change an intensity distribution within a beam cross section of the laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.