Thermally conductive silicone gel composition
US12152147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2020 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.