System and method for detecting defective back-drills in printed circuit boards
US12153084B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2021 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | May 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.