Patent · US Active

RFID assembly and assembly method thereof

US12153983B2 · kind B2 · utility

0Cited by

6References

14Claims

0Family size

Assignee

EM Microelectronic-Marin SA · CH

Inventors

Paul Muller · Heidelberg, DE
Christophe Entringer · Brignoud, FR
Pierre-Jean Muller · Marin-Epagnier, CH
Thomas Coulot · Vercel-Villedieu-le-Camp, FR
Arthur Hugh MacDougall · Cornaux, CH

Key dates

Filing date	Nov 1, 2021
Grant date	Nov 26, 2024
Priority date	—
Expiry date	Nov 1, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07752
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at least one re-passivation layer. The at least one electrical contact is deposited on at least one first portion and the at least one re-passivation layer is deposited on at least one second portion, which is distinct of the at least one first portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.