Semiconductor device and semiconductor package having the same
US12154840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2023 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | May 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction perpendicular to the second surface, and a horizontal thermal conductivity in a direction parallel to the second surface, the first vertical thermal conductivity being smaller than the first horizontal thermal conductivity, and a second heat dissipation member comprising a vertical pattern penetrating the first heat dissipation member, the second heat dissipation member having a vertical thermal conductivity that is greater than the vertical thermal conductivity of the first heat dissipation member may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.