Semiconductor package including antenna
US12154873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2023 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Mar 24, 2043 |
Classification
- Technology area (CPC —)General
Abstract
A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.