Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof
US12155142B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jan 27, 2021 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jan 27, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.