Method for manufacturing ceramic substrate and ceramic substrate
US12155367B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | May 7, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by positioning a hole in at least one ceramic green sheet among a plurality of laminated ceramic green sheets in a location that does not overlap with a recess formation-planned region in which a recess is to be formed after firing of the mother multilayer body and that overlaps with a singulation-planned line for singulating the mother multilayer body into pieces after firing; and forming the recess in the mother multilayer body before firing by performing press working on the recess formation-planned region of the mother multilayer body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.