Method and configuration for stacking multiple printed circuit boards
US12156333B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2022 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Feb 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10606
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. In some embodiments, the present invention may be directed to an electronic module that includes a pair of printed circuit boards (PCBs) and a capacitor positioned between the PCBs. Each of the PCBs may include a pair of vias configured to provide electrical connections through the PCB, and the capacitor may include a pair of pins. Each pin of the capacitor may be aligned with a via of one of the PCBs and a corresponding via of the other PCB such that each pin is configured to provide electrical connection between the two PCBs. Additionally, the pair of pins may be configured to support the PCBs with respect to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.