Wiring board and method for manufacturing wiring board
US12156337B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2021 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Dec 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0307
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.