Patent · US Active

Manifold for liquid cooled computing systems

US12156374B2 · kind B2 · utility

0Cited by
7References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 29, 2022
Grant dateNov 26, 2024
Priority date
Expiry dateJun 1, 2043

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K7/20763
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A manifold system includes a supply manifold and a return manifold. The supply manifold delivers fluid to cold plates to cool processing units of a computing system. The return manifold receives the fluid from the cold plates. The supply manifold has supply fluid ports equidistantly spaced about the side surface of the supply manifold, and the return manifold has return fluid ports equidistantly spaced about the side surface of the return manifold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.