Manifold for liquid cooled computing systems
US12156374B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jun 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20763
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manifold system includes a supply manifold and a return manifold. The supply manifold delivers fluid to cold plates to cool processing units of a computing system. The return manifold receives the fluid from the cold plates. The supply manifold has supply fluid ports equidistantly spaced about the side surface of the supply manifold, and the return manifold has return fluid ports equidistantly spaced about the side surface of the return manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.