Semiconductor storage device
US12156379B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2022 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jun 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor storage device according to an embodiment includes a housing, a board, a semiconductor memory component, a controller, and a heat-dissipation structure. The heat-dissipation structure includes a plurality of first heat-dissipation fins, a plurality of second heat-dissipation fins, and a first cover portion. The plurality of the first heat-dissipation fins are on a first region of the housing. The plurality of the second heat-dissipation fins are on a second region of the housing. The first cover portion is between the plurality of the first heat-dissipation fins and the plurality of the second heat-dissipation fins, or the first cover portion is at a gap between the second heat-dissipation fins. The first cover portion covers at least a part of the gap between the second heat-dissipation fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.