Devices, systems, and methods for a hybrid cooling system
US12156383B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2022 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | May 27, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some aspects, the techniques described herein relate to a cooling system for a computing device. The cooling system includes an air-cooled cooling system located in a housing. The air-cooled cooling system includes a heat sink thermally connected to a processor, an air-cooling radiator, and a heat pipe connecting the heat sink to the air-cooling radiator. The cooling system includes a liquid-cooled cooling system located in the housing. The liquid-cooled cooling system includes a cold plate thermally connected to a to the heat sink, a pump, a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.