Patent · US Active

Evaluation method, evaluation system, and laser machining system

US12157180B2 · kind B2 · utility

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0References
12Claims
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Key dates

Filing dateOct 5, 2021
Grant dateDec 3, 2024
Priority date
Expiry dateMay 19, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K37/0417
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

An evaluation method for evaluating laser machining in which irradiation region of a laser beam is moved relative to object to perform machining of object, includes a measurement step and an evaluation step. In the measurement step, a change in an intensity of light according to a movement of measurement region is measured by moving measurement region for measuring the intensity of light, relative to object. In the evaluation step, an evaluation of the laser machining is performed based on the change in the intensity of light according to the movement of measurement region. In the measurement step, measurement region is moved relative to object so that movement path of measurement region has a plurality of intersections with movement path of irradiation region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.