Heat sealed packaging assemblies and methods of producing and using the same
US12157621B2 · kind B2 · utility
0Cited by
189References
20Claims
0Family size
Inventors
Key dates
| Filing date | Sep 17, 2021 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Sep 17, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D5/5028
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A packaging device can include a resilient member formed of one or more layers of different materials and a frame member. The resilient member can be heat sealed to the frame member or to a coating on the surface of the frame member. The layers can be made from different materials or the same materials having different thicknesses, modules of elasticity, melting index, or other different characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.