Versatile vacuum deposition sources and system thereof
US12157942B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 10, 2022 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Mar 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M2004/027
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A versatile high throughput deposition apparatus includes a process chamber and a workpiece platform in the process chamber. The workpiece platform can hold a plurality of workpieces around a center region and to rotate the plurality of workpieces around the center region. Each of the plurality of workpieces includes a deposition surface facing the center region. A gas distribution system can distribute a vapor gas in the center region of the process chamber to deposit a material on the deposition surfaces on the plurality of workpieces. A magnetron apparatus can form a closed-loop magnetic field near the plurality of workpieces. The plurality of workpieces can be electrically biased to produce a plasma near the deposition surfaces on the plurality of workpieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.