Wafer inspection system and annular seat thereof
US12158493B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2023 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2865
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.