Wireless power transfer thin profile coil assembly
US12159745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2018 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | May 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/348
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. The first and second conductor patterns are placed relative to one another so as to provide flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, conformal spacing layers, an eddy current shield layer and an assembly enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.