Info packages including thermal dissipation blocks
US12159791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2023 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Jul 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.