Patent · US Active

Wafer processing method and carrier

US12159794B2 · kind B2 · utility

0Cited by

1References

11Claims

0Family size

Assignee

SCIENTECH CORPORATION · US

Inventors

Chuan-Chang Feng · Chandler, US
Mao-Lin Liu · Toronto, CA

Key dates

Filing date	Jan 13, 2022
Grant date	Dec 3, 2024
Priority date	—
Expiry date	Mar 11, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67796
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This disclosure provides a wafer processing method having the following steps: providing a wafer (10), an immersion device (100), a carrier (200), and a spray device (300); turning the wafer (10) from a horizontal manner to an upright manner; upright placing the wafer (10) into the immersion device (100) for immersion; taking the wafer (10) out from the immersion device (100) and placing that onto the carrier (200) horizontally; spraying a liquid on the wafer (10) by the spray device (300); rinsing the wafer (10); rotating the carrier (200) to dry the wafer (10). Multiple steps for processing the wafer (10) may be performed on the same carrier (200) to accelerate the process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.