Transversely-excited film bulk acoustic resonator package
US12160225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2020 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Jan 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6406
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Acoustic resonator devices and filters; and methods of their fabrication are disclosed. A piezoelectric plate is bonded to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity that is formed in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer on the diaphragm, and first contact pads. Walls of an interposer back surface are formed onto the resonator front surface and surround the diaphragm. An interposer cover layer is formed on the walls, spans the walls and creates an enclosed interposer cavity over the diaphragm. A second conductor pattern is formed on the walls and cover layer that includes second contact pads on the interposer back surface; and connections that electrically connect the first contact pads to respective ones of the second contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.