Patent · US Active

Heatsink based power delivery for CPUs

US12160945B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Dell Products L.P. · US

Inventors

Sandor Farkas · Round Rock, US
Mark A. Smith · Huntington Woods, US
Bhyrav M. Mutnury · Austin, US

Key dates

Filing date	Dec 20, 2023
Grant date	Dec 3, 2024
Priority date	—
Expiry date	Dec 20, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10962
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An information handling system includes a PCB, a CPU, a power distribution hat, and a heat sink. The PCB includes a first power contact on a first surface of the PCB and a first ground contact on a second surface of the PCB. The CPU includes a substrate and is affixed and electrically coupled to the first surface of the PCB by a first surface of the substrate. A second surface of the substrate includes a second power contact and a second ground contact. The power distribution hat couples the first power contact with the second power contact. The heat sink couples the first ground contact with the second ground contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.