Image sensor package and camera device including same
US12160946B2 · kind B2 · utility
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0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2021 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Oct 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.