Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board
US12160959B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 27, 2022 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonded body includes a ceramic substrate and a copper plate, in which the copper plate is bonded to the ceramic substrate via a bonding layer, the copper plate includes a surface perpendicular to a direction in which the ceramic substrate and the copper plate are bonded, and a number percentage of copper crystal grains having major diameters greater than 400 μm in three 5 mm×5 mm regions included in the surface is not less than 0% and not more than 5%. The bonding temperature is favorably not more than 800° C. The number percentage of the copper crystal grains having major diameters greater than 400 μm is favorably not more than 1%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.