Application interface for metal foam cooling of vehicle electronics
US12160976B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2022 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Jun 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0086
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure describes systems and methods for metal foam cooling of vehicle electronic. An example apparatus may include an electronic control unit (ECU) comprising an electronic component included within a housing. The example apparatus may also include a metal foam configured to dissipate heat produced by the electronic component and also configured to facilitate electromagnetic interference (EMI) shielding for the electronic component. The example apparatus may also include an interface between the ECU and the metal foam, wherein the interface provides a connection between the ECU and metal foam to facilitate heat dissipation from the electronic component to a location outside of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.