Patent · US Active

Direct cooling of a power converter by using a stamped plate

US12160982B2 · kind B2 · utility

0Cited by

1References

14Claims

0Family size

Assignees

AUDI AG · DE
Hitachi Energy Ltd · CH

Inventors

Thomas Gradinger · Aarau, CH
Andreas Apelsmeier · Pollenfeld, DE
Benjamin SÖHNLE · Ingolstadt, DE
Daniele Torresin · Baden, CH

Key dates

Filing date	Feb 27, 2020
Grant date	Dec 3, 2024
Priority date	—
Expiry date	Mar 18, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/473
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.