Polyamide resin
US12162985B2 · kind B2 · utility
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4References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 9, 2021 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a polyamide resin having a low mass loss at a temperature slightly higher than the melting point. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units, and of the diamine-derived structural units, from 70 to 97 mol % are derived from p-benzenediethanamine and from 3 to 30 mol % are derived from a diamine represented by formula (1). 50 mol % or more of the dicarboxylic acid-derived structural units are derived from an aromatic dicarboxylic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.