Thermal interface material
US12163091B2 · kind B2 · utility
0Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2021 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jul 13, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/014
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided herein is a composition for use as a thermal interface material in a heat-generating device. The composition comprises a first part and a second part, the first part comprising polyisobutylene, a reactive diluent mixture, a catalyst, and one or more thermally conductive fillers, and the second part comprising polyisobutylene, the reactive diluent mixture, a silicone based cross-linker, an inhibitor and one or more thermally conductive fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.