Substrate comprising a silver-plated surface protected against silver tarnishing and method for manufacturing such a substrate
US12163217B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2019 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Apr 26, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/627
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate includes a final silver-plated surface protected against silver tarnishing by a protective coat having a thickness between 1 nm and 200 nm, the protective coat includes a first coat of Al2O3 deposited on said final silver-plated surface and having a thickness between 0.5 nm and 100 nm, and on the first coat of Al2O3, a second coat of TiO2 having a thickness between 0.5 nm and 100 nm, the substrate including a coat of a silver and copper alloy comprising between 0.1% and 10% by weight of copper with respect to the total weight of the alloy, forming said final silver-plated surface, said coat of a silver and copper alloy having a thickness between 1000 nm and 3000 nm. Embodiments also relate to a method for manufacturing such a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.