Module ensuring an attenuation of sound waves and a heat exchange
US12163469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2022 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jun 15, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A module ensuring an acoustic attenuation of a flow of a first fluid and a heat exchange between the first fluid and a second fluid. The module comprises a perforated first wall with a cutout, a second wall, a cellular structure extending from the second wall to the first wall, a recess provided in the cellular structure between a perforated bottom and a perforated top, and a heat exchanger which is fixed inside the recess between the bottom and the top and in which the second fluid circulates. Such a module ensures an attenuation of sound waves and a heat exchange without limiting the attenuation surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.