Method and apparatus for forming liquid filled heat transfer device
US12163739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2020 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F3/08
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.