Packaged current sensor integrated circuit
US12163983B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2022 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Apr 19, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R19/16566
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by one or more magnetic sensing elements supported by a semiconductor die adjacent to the primary conductor. A method of fabricating the packaged current sensor integrated circuit includes partially encasing the lead frame in a first mold material, applying an insulator to one or more die attach pads, attaching a die to the insulator, electrically connecting the die to secondary leads, and providing a second mold to the subassembly. The package is configured to provide increased voltage isolation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.