Telemetry-based model driven manufacturing test methodology
US12164400B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2022 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | May 7, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3495
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An approach is presented herein to use an in-situ algorithmic decision methodology during each stage of testing before 2C/4C to decide how long to test, how much margin should be used for each device under the test (DUT) to shorten or eliminate 2C/4C testing. Each DUT will be tested differently based on the risk level or the likelihood of failure at 2C/4C. To be able to achieve this, low-level hardware (HW) based sensors (on the printed circuit board assembly (PCBA), in power module, in silicon components, in silicon component complex, etc.) are used to collect telemetry data with a high frequency data acquisition rate during the testing. As testing is ongoing for each DUT, a margin distribution and algorithm modeling is performed in-situ.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.