Display substrate and preparation method thereof, and display panel and preparation method thereof
US12166155B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2020 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Aug 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure discloses a display substrate, including a substrate, and a driver circuit, an insulation layer and a bonding electrode sequentially superposed on the substrate. The bonding electrode is configured to be connected to an anode and a cathode of a micro inorganic light-emitting diode chip to be bonded. The display substrate further includes an elastic layer sandwiched between the bonding electrode and the insulation layer, the elastic layer having an orthographic projection on the substrate covering at least an orthographic projection of the bonding electrode on the substrate. The present disclosure provides a display panel, including the above display substrate, and further including a micro inorganic light-emitting diode chip having an anode and a cathode thereof connected to the bonding electrode on the display substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.