Shielded interconnect system
US12167582B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2021 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Apr 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.