Method for applying a material containing a meltable polymer, more particularly a hot-melt adhesive, above the decomposition temperature thereof

US12168319B2 · kind B2 · utility

Assignee

• Covestro Intellectual Property GmbH & Co. KG · DE

Inventors

• Dirk Achten · Leverkusen, DE
• Thomas Buesgen · Leverkusen, DE
• Joerg Tillack · Solingen, DE
• Peter Reichert · Thousand Oaks, US
• Nicolas Degiorgio · Krefeld, DE
• Martin Melchiors · Leverkusen, DE
• Wolfgang Arndt · Dormagen, DE

Key dates

• Filing date: Feb 13, 2019
• Grant date: Dec 17, 2024
• Expiry date: Mar 17, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G2170/20
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

The invention relates to a method for applying a material containing a meltable polymer comprising the step of applying a filament of the at least partially molten material from a discharge opening of a discharge element onto a substrate. The meltable polymer has the following properties: —a melting point (DSC, differential scanning calorimetry; second heating with a heating rate of 5° C./min) in a range from ≥40° C. to ≤120° C.; —a glass transition temperature (DMA, dynamic mechanical analysis in accordance with DIN EN ISO 6721-1:2011) in a range from ≥−70° C. to ≤30° C.; —a storage modulus G′ (parallel plate oscillation viscometer in accordance with ISO 6721-10:2015 at a frequency of 1/s) at 20° C. above the melting point of ≥1·104 Pa; —a storage modulus G′ (parallel plate oscillation viscometer in accordance with ISO 6721-10:2015 at a frequency of 1/s) at 10° C. below the melting point with prior heating to a temperature of 20° C. above the melting point and subsequent cooling with a cooling rate of 1° C./min of ≤1·107 Pa; wherein the filament has an application temperature of ≥100° C. above the melting point of the meltable polymer for ≤5 minutes during the application process …